Date: December 7, 2012
Speaker: Prof. Vladimir Stojanovic, Associate Professor, MIT
Location: 750 CEPSR
Hosted by: Prof. Keren Bergman
Chip design is radically changing. This period of change is a very exciting time in integrated circuit and system design. On one hand, cross-layer design approaches need to be invented to improve system performance despite the CMOS scaling slowdown. On the other, a variety of emerging devices are lined-up to extend or potentially surpass the capabilities of CMOS technology, but require key innovations at the circuits and system level. Both offer tremendous opportunity for gains through cross-cut system design.
This talk illustrates several examples of our cross-cut design approach. The design examples focus on development of integrated information transfer systems (e.g. manycore processor and memory systems, and network communication infrastructure), with scaled electronics, as well as emerging mechanical and photonic devices. Cross-layer modeling and design connect process, device and circuit optimizations to system-level metrics, enabling early technology demonstration platforms. The experimental platforms illustrate the technology potential at the system level and provide feedback to modeling and device design. In particular, we'll describe the recent breakthroughs in monolithic photonic memory interface platform with fastest and most energy-efficient modulators demonstrated in a 45nm process node. We'll also describe the recent results in building VLSI systems with electro-mechanical relay devices, showing a record number of smallest functional relays integrated into a VLSI circuit to date. Based on these design principles and technology demonstrations, we project that in the next decade tailored hybrid (electrical/optical and mechanical) integrated systems will provide orders of magnitude performance improvements at the system level and revolutionize the way we build future VLSI systems.
Vladimir Stojanovic is the Emanuel E. Landsman Associate Professor of Electrical Engineering and Computer Science at MIT. His research interests include design, modeling and optimization of integrated systems, from CMOS-based VLSI blocks and interfaces to system design with emerging devices like NEM relays and silicon-photonics. He is also interested in design and implementation of energy-efficient electrical and optical networks, and digital communication techniques in high-speed interfaces and high-speed mixed-signal IC design. Vladimir received his Ph.D. in Electrical Engineering from Stanford University in 2005, and the Dipl. Ing. degree from the University of Belgrade, Serbia in 1998. He was also with Rambus, Inc., Los Altos, CA, from 2001 through 2004. He received the 2006 IBM Faculty Partnership Award, and the 2009 NSF CAREER Award as well as the 2008 ICCAD William J. McCalla, 2008 IEEE Transactions on Advanced Packaging, and 2010 ISSCC Jack Raper best paper awards. He is an IEEE Solid-State Circuits Society Distinguished Lecturer for 2012-2013.